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HDI Fourteen Layer First Order Board PCB And Four Layer Power Board PCB

Topmatch Electronics (Suzhou) Co., Limited.
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    Buy cheap HDI Fourteen Layer First Order Board PCB And Four Layer Power Board PCB from wholesalers
     
    Buy cheap HDI Fourteen Layer First Order Board PCB And Four Layer Power Board PCB from wholesalers
    • Buy cheap HDI Fourteen Layer First Order Board PCB And Four Layer Power Board PCB from wholesalers

    HDI Fourteen Layer First Order Board PCB And Four Layer Power Board PCB

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    Brand Name : TOPCBS
    Model Number : 0.95mm Anylayer HDI / 12L mainboard
    Certification : UL94V0
    Price : Negotiation
    Payment Terms : T/T
    Supply Ability : 10000unit per month
    Delivery Time : 10-14working days
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    HDI Fourteen Layer First Order Board PCB And Four Layer Power Board PCB

    HDI Fourteen Layer First-Order Board PCB and Four Layer Power Board PCB


    Definitions and standards for HDI

    . 1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs
    . Blind/buried vias with sequential lamination
    . HDI build up micro via technology with solid copper filled vias
    . Via in pad technology with conductive and non-conductive filled vias
    . Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm.
    . Special materials and hybrid construction


    Specifications:

    Name0.95mm Anylayer HDI / 12L mainboard
    Number of Layers12
    Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
    MaterialEM370(D)
    Thickness0.95mm
    Min Track/Spacing50um/60um
    Min Hole SizeLaser 75um; Drilling size 200um
    Solder MaskBlue
    SilkscreenWhite
    Surface FinishImmersion gold,OSP
    Finished Copper12um
    Production time10-21 working days
    Lead time2-3 days

    3. Advantages:


    The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

    Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.



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